The hot summer has arrived, and although the illuminated sign only starts working at night, it can still be ignited by the weather. Therefore, high brightness LED illuminated signs must have strong heat dissipation function. Let's take a look at the following points to pay attention to when cooling:

1. The heat management of luminescent character signs is the main problem in the application of high brightness LED products: due to the p-type doping of group III nitrides being limited by the solubility of Mg acceptors and the high starting energy of holes, its heat is easily generated in the "p-type" area, and the heat must pass through the entire structure to dissipate on the heat sink; The heat dissipation pathways of LED components mainly include thermal conduction and convection; The extremely low thermal conductivity of the "Sapphire" substrate material leads to an increase in the thermal resistance of the device, resulting in a serious self-heating effect and a devastating impact on the performance and reliability of the device.

2. The impact of the heat of the luminescent character sign on the brightness of high LED products: The heat of the luminescent character is concentrated in a very small chip, and the temperature of the chip increases, causing non-uniform distribution of thermal stress, a decrease in chip luminous efficiency, and fluorescence powder lasing efficiency; When the temperature exceeds a certain value, the device failure rate increases exponentially. Statistical data shows that for every 2 ℃ increase in component temperature, reliability decreases by 10%. When multiple LEDs are densely arranged to form a white light lighting system, the problem of heat dissipation is more severe. Solving heat management issues has become a prerequisite for high brightness LED applications.

3. The relationship between the chip size of luminescent words and heat dissipation: Firstly, the most direct way to improve the brightness of power LEDs is to increase the input power. To prevent saturation of the active layer, the size of the p-n junction must be correspondingly increased; Increasing the input power will inevitably increase the junction temperature, thereby reducing quantum efficiency. The improvement of single transistor power depends on the ability of the device to export heat from the p-n junction. While maintaining the existing chip material, structure, packaging process, current density on the chip, and equivalent heat dissipation conditions, increasing the chip size alone will continuously increase the junction temperature. Thanks to the global shortage of energy resources and environmental pollution, LED has broad application space due to its energy-saving and environmental protection characteristics. The application of LED luminous products in the lighting field is attracting the attention of the world. Generally speaking, the stability and quality of LED lights are crucial to the heat dissipation of the lamp body. Currently, natural heat dissipation is often used for the heat dissipation of high brightness LED lights in the market, but the effect is not ideal.

LED lighting fixtures made from LED light sources are composed of LED, heat dissipation structure, driver, and lens, so heat dissipation is also an important part. If the LED cannot dissipate heat well, its lifespan will also be affected. The LED luminescent character signs produced by the bright color advertising signs use imported chips, which have excellent heat dissipation effect. Therefore, businesses do not need to worry about the self ignition of the luminescent character signs due to heat dissipation issues.